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Dimensions and Assembly

The Jupiter Servo Drive is available in 5 versions, each one with different specifications and dimensions:

  • JUP-20/80-y
  • JUP-40/80-y
  • JUP-15/130-y
  • JUP-30/130-y
  • JUP-x/xx-E (Jupiter with EtherCAT).

Fixation elements diameter ≤ 6 mm

Please do not use spacers, washers or nuts exceeding 6 mm external diameter as they could collide with some electrical parts.

Also, take due precautions not to damage any components during assembly.

3D step files can be downloaded here: STEPS 


JUP-20/80-y

Jupiter Servo Drive version JUP-20/80-y has a 100 mm x 100 mm footprint and a maximum 25.6 mm height. The drive is provided with 4 x Ø 4.3 mm holes for M4 standoff mounting as well as 4 x Ø 3.2 mm for M3 standoffs to allow mounting the EtherCAT Daughter Board and the IO Starter Kit. The 4 Ø 4.3 mm holes and 2 of the Ø 3.2 mm holes are plated and connected to protective earth (PE). 

Next figure shows mechanical dimensions in mm. Tolerances ≤ ±0.2 mm.

 


Jupiter version JUP-20/80-y can also be provided with a cooling plate, allowing to fix the board to a heat sink (with 4 x Ø 4.6 mm holes for M4 screws). Next figure shows mechanical dimensions in mm. Tolerances ≤ ±0.2 mm.

JUP-40/80-y

Jupiter Servo Drive version JUP-40/80-y has a 120 mm x 102 mm footprint and a maximum 28.1 mm height. The drive is provided with a cooling plate, allowing to fix the board to a heat sink (with 4 x Ø 4.6 mm holes for M4 screws). Jupiter also has 4 x 3.2 Ø for M3 standoffs to allow mounting the EtherCAT Daughter Board and the IO Starter Kit. 

Next figure shows mechanical dimensions in mm. Tolerances ≤ ±0.2 mm.

 

JUP-15/130-y

Jupiter Servo Drive version JUP-15/130-y has a 120 mm x 102 mm footprint and a maximum 31.6 mm height. The drive is provided with a cooling plate, allowing to fix the board to a heat sink (with 4 x Ø 4.6 mm holes for M4 screws). Jupiter also has 4 x 3.2 Ø for M3 standoffs to allow mounting the EtherCAT Daughter Board and the IO Starter Kit. 

Next figure shows mechanical dimensions in mm. Tolerances ≤ ±0.2 mm.

JUP-30/130-y

Jupiter Servo Drive version JUP-30/130-y has a 120 mm x 102 mm footprint and a maximum 31.6 mm height. The drive is provided with a cooling plate, allowing to fix the board to a heat sink (with 4 x Ø 4.6 mm holes for M4 screws). Jupiter also has 4 x 3.2 Ø for M3 standoffs to allow mounting the EtherCAT Daughter Board and the IO Starter Kit.

Next figure shows mechanical dimensions in mm. Tolerances ≤ ±0.2 mm.

  

JUP-x/xx-E (Jupiter with EtherCAT)

Jupiter Servo Drive version JUP-x/xx-E has a 100 mm x 100 mm footprint and a maximum 26 mm height. The drive is provided with 4 x Ø 4.3 mm holes for M4 standoff mounting

Next figure shows mechanical dimensions in mm. Tolerances ≤ ±0.2 mm.

 

          

Assembly Instructions

The assembly of the plate to a cooling surface is essential to achieve desired performance. Due to the dimensions of the plate, it is essential that the thermal pad is soft enough to compensate the flexing during assembly. Next are some thermal interface materials suitable for the Jupiter.

Heatsinks

In order to choose the cooling needs of the Jupiter, please see the thermal calculations in Dimensions and Assembly page. Other heatsink models are totally acceptable. 

Manufacturer

Type

Part Number

Thermal resistance

Dimensions

Image

Manufacturer

Type

Part Number

Thermal resistance

Dimensions

Image

Wakefield-Vette

Heatsink with natural convection

511-6U

0.65 °C/W

152.4 mm x 132.33 mm x 61.21 mm

Delta ElectronicsHeatsink with natural convectionDHS-B9292-04A0.25 °C/W91.5 mm x 91.5 mm x 25.5 mm

Please use appropriate thermal interface materials and follow the assembly instructions to achieve an excellent heat transfer. See below 👇.

Thermal interface material

Although Jupiter Servo Drive can be mounted directly on a heatsink for low power applications, it is always recommended to use a thermal interface material between the plate and the heatsink. Silicone based thermal paste offers appropriate heat transfer, however it is dirty and difficult to use and commission. 

Ingenia recommends thermal interface materials like gap pads or thermal sheets that are tacky and soft to prevent the formation of air bubbles and have maximum specific area of contact. Please note that thin "high performance" materials that look promising on the datasheet may end up with poor heat transfer. With thin materials the pressure is only applied near the screws and air cavities are formed, decreasing the heat transfer dramatically. Following are some materials recommended by Ingenia.

Manufacturer

Part Number

Description and comments

Thickness before compression

Thermal conductivity

Estimated thermal resistance plate to heatsink (with an area of 90 mm x 90 mm)

Laird TechnologiesA15372-02Phase change material. Provides best heat transfer for perfectly flat rectified heatsinks. Do not use if the surface is not rectified or residue is not acceptable.0.127 mm3.8 W/m·ºC0.004 ºC/W
BergquistGPHC5.0-0.020-02-0816Conformable gap pad, recommended for most applications.0.51 mm5.0 W/m·ºC0.012 ºC/W
t-Global TechnologyH48-6A-320-320-0.5-1AConformable gap pad, recommended for most applications.0.50 mm4.0 W/m·ºC0.015 ºC/W
BergquistBP100-0.005-00-1112Adhesive double side thermal tape. Provides excellent heat transfer for permanent installations. The adhesive is pressure sensitive, follow the manual instructions.0.127 mm0.8 W/m·ºC0.020 ºC/W



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