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Product Description

The Titan Go Servo Drive is a high power density solution providing top performance, advanced networking and built-in hardware and firmware based safety, as well as a fully-featured motion controller. It can control multiple motor types and supports almost any feedback sensor including absolute serial encoders and resolvers. 

Its design includes multiple communication ports as CANopen, RS-485, USB all of them are electrically isolated.

The Titan Go Servo Drive has been designed with efficiency in mind. It incorporates cutting-edge power semiconductor technology as well as optimized control algorithms to provide the perfect trade-off between electromagnetic emissions and performance.

Titan part numbering

Ordering part numberStatusImage
TTN-150/200-C-C-CCMO

PRODUCTION

-
TTN-100/400

OBSOLETE

-


Specifications

A list of features of the Titan Go Servo Drive is shown next. 

Electrical and power specifications

Part numberTTN-150/200TTN-100/400

Power supply voltage

10 VDC to 200 VDC

10 VDC to 400 VDC
Auxiliary logic supply input voltage range

10 VDC to 65 VDC

Standby logic supply consumption

≤ 10 W

Transient peak voltage220 VDC450 VDC
DC bus capacitance63 µF (+224 µF if CCMO version is chosen)
Minimum motor inductance
50 µH (for low inductance motors use high PWM frequency mode)50 µH

Nominal phase continuous
current (BLDC mode)

150 ARMS

(with heatsink)

65 ARMS

(with heatsink)

Nominal phase continuous
current (DC mode)

150 ADC65 ADC

Maximum phase peak current

250 ADC (1 s)85 ADC  (1 s)
Current sense range

± 457 A (Versions 1.0.0 and 1.1.0)

± 359 A (Version 1.2.0)

Current sense resolution

893 mA/count (Versions 1.0.0 and 1.1.0)

701.8 mA/count (Version 1.2.0)
Shunt braking transistor 

Low side shunt braking transistor on board. 100 A continuous braking current capacity.

Inrush current< 10 A at connection. Titan includes a 2 kΩ DC bus capacitor precharge resistor that limits the inrush. No need for external capacitor precharge circuits or relays.
Cold plate7 mm aluminum plate 6082-T6.
Power connectors

Power ring terminals with M8 screws and washers included.

The maximum absolute screw torque is 9 Nm.

Do not exceed 9 Nm in any axis to the power connectors, take care of bus bars and thick motor cables.

Efficiency

>97% at the rated power and current.

Note that the 400 V 100 A version is more efficient at low load, while the 200 A version is efficient at high load.

Motion control specifications

Supported motor types

  • Rotary brushless (trapezoidal and sinusoidal)
  • Linear brushless (trapezoidal and sinusoidal)
  • DC brushed
  • Rotary voice coil
  • Linear voice coil

Power stage PWM frequency

10 kHz (default)
20 kHz (alternative PWM frequency, configurable, preferred for low inductance motors)

Current sensing

Isolated current sense on phases A, B, and C.
Accuracy is ± 2% full scale. 10 bit ADC resolution.

Sensors for commutation

(brushless motors)

  • Digital Halls (Trapezoidal)
  • Digital Quadrature encoder (Sinusoidal / Trapezoidal)
  • PWM encoder (Sinusoidal / Trapezoidal)
  • Analog potentiometer (Sinusoidal / Trapezoidal)
  • Resolver (Sinusoidal)
  • Sensorless Mode (Sinusoidal)
  • Sin/Cos encoder (Sinusoidal). (from version 1.2.0)
  • Absolute encoder SSI (Sinusoidal / Trapezoidal)

It is recommended to install the SSI only firmware variant if absolute encoder SSI is used for commutation.

Sensors for servo loops
  • Digital Halls 
  • Digital Quadrature encoder
  • Absolute encoder (SSI)
  • PWM encoder 
  • Analog potentiometer 
  • DC tachometer
  • Resolver
  • Sin/Cos encoder (from version 1.2.0)

Supported target sources

  • Network communication – USB (for configuration or in-house updates, USB is not recommended for operation in field as it is a weak interface in high power - high noise environments)
  • Network communication – CANopen
  • Network communication – RS-485
  • Standalone (execution from internal EEPROM memory)
  • Analog inputs
  • Step and Direction (Pulse and Direction)
  • PWM command
  • Encoder Following / Electronic Gearing
Resolver specifications
  • Excitation voltage: Pure sine wave 3.8 Vrms 10.8 Vp-p. It can work with higher voltage rated resolvers as well.
  • Excitation frequency: 10 kHz
  • Resolver gain (transformation ratio): 0.5  ± 20% (default). Any other on demand. Contact Ingenia.
  • Input differential resistance ~ 24 kΩ

Inputs/outputs and protections

General purpose Inputs and
outputs
  • 5 x isolated single-ended digital inputs. GPI1, GPI2, GPI3, HS_GPI1, HS_GPI2 (5 V TTL logic)
  • 1 x isolated (±10 V) differential analog input (12 bits). AN_IN1
  • 1 x isolated digital output. GPO1 (3.3V logic)
Dedicated Inputs and outputs
  • 2 x isolated Safe Torque Off inputs (24V level).
  • 1 x isolated Safe Torque Off status feedback optocoupler output.
  • 1 x motor temperature sensing input
Output Supplies
  • 1 x 5 V output supply for powering external circuitry (up to 200 mA). Short circuit protected, ±2% tolerance.
  • 1 x 24 V output supply for external circuitry such as fans, relays or STO (up to 400 mA). ±25% unregulated tolerance. Not short-circuit protected.

Protections

  • User-configurable:
    • DC bus over-voltage
    • DC bus under-voltage
    • Drive over-temperature
    • Drive under-temperature
    • Over-current
    • Overload (I2t)
  • Short-circuit protections: 
    • Phase to SUP+
    • Phase to SUP-
    • Phase to phase
    • Phase to Earth
  • Mechanical limits for homing functions
  • Hall sequence/combination error
  • ESD protections in all inputs, outputs, feedbacks and communications
  • EMI protections (noise filters) in all inputs, outputs and feedbacks
  • Can drive an external power braking resistor in case of re-injection
Safe Torque Off

2 x STO inputs, 24 V isolated inputs (work from 15 V to 30 V). Redundant topology with self-test features. Ready for SIL 3 reliability level but not certified.

1 x STO feedback indication output for external self-verification circuit.

Minimum pulse width for Safe Torque Off activation (and power stage shutdown): 14 ms

Minimum pulse width for STO feedback reaction: 1 ms.

Pulses < 1 ms can be used for safety PLCs but will be ignored. Pulses between 14 ms and 1 ms can be used for self test.

Motor BrakeNot available.

Communications

USBMiniUSB (2.0) vertical connector. Fully isolated 2.5 kVRMS 1 min.
Serial

RS-485 full-duplex (compatible with RS-422) isolated 2.5 kVRMS.

Default 115200 bps, 8 data bits, no parity, 1 stop bit, no flux control.

120 Ω terminations for TX and RX included on board with DIP switches.

TX+ and RX+ biased to +5 V with 4.7 kΩ. TX- and RX- biased to GND with 4.7 kΩ.

CANopen

CANopen compliant with isolation (self powered, no need for external supply). 1 Mbps max (default).

120 Ω termination included on board with a DIP switch. CiA-301, CiA-303, CiA-305, CiA-306 and CiA-402 compliant. 

EtherCAT-

Environmental and mechanical specifications

Part number →


Cold plate temperature
  • -40ºC to +85ºC full current (with appropriate heatsink)
  • +85ºC to 110ºC derated current.
Heat dissipation

The maximum heat dissipation is 4 kW. Provide a heatsink according to environment temperature and power rating. Heat dissipation is affected mainly by the phase current and voltage.

In order to achieve the maximum power ratings, excellent heat transfer is needed between the cold plate and a heatsink. Please see Dimensions and assembly for details.

Maximum humidity

5% - 85% (non-condensing). Titan can be supplied with conformal coating.

Horizontal dimensions206 x 172 mm
Maximum height55 mm
Weight (exc. mating connectors)1878 grams

Hardware revisions

Hardware revision

Individual board references

Description and changes

1.0.0

May 2017

i047-01H1-1.0.0

i047-01H2-1.0.0

i047-01H3-1.0.0

First product beta release.

1.1.0

September 2017

i047-01H1-1.1.0

i047-01H2-1.1.0

i047-01H3-1.1.0

First product release. Changes from the previous version:

  • Modifications on the aluminum cooling plate, reduction of 1 mm thickness and added extra PCB support area for better vibration and thermal performance.
  • Added 2.5 kV isolation to USB ports. The drive is no longer powered from USB but communication reliability is greatly enhanced.
  • Change high voltage notification LED to blue for better visibility.
  • Enabled the main DC/DC converter that is powered from the DC bus. Auxiliary 24V power supply input becomes optional.
  • Improved protections for the 24V output supply.
  • Added 24V bus monitoring.
  • Added motor temperature sensing input.
  • Added pre-biasing resistors 4.7 kΩ to the RS485 lines. Pull up to 5 V for positive GND for negative.
  • Modified HALLs circuit with galvanic isolation.
  • Manufacturing PCA improvements.
  • Added mechanical stress relief slots on the power board.
  • Added electrical creepage slots on the control board.
  • Modified version TTN-200/400 with IGBTs to improve performance at high load.
  • Improved creepage distances on the power stage.
  • Changed PCB finishes to unify black aspect on all boards and increase radiation heat dissipation at high altitude.
  • Modified PCB design for with IPC class 3/A. High-reliability aerospace requirements.
  • Changed shunt recirculation diode.
  • Modified STO circuit for SIL3 compliance. Increased minimum pulse time to 20 ms to allow self-test functions.
  • Improve the thermal performance of some internal power supplies.
  • Solved CAN hardware blocking bug.
  • Increased DC bus capacitance on all variants.

1.2.0

January 2018

i047-01H1-1.2.0

i047-01H2-1.2.0

i047-01H3-1.2.0

Improvements in current sensing and EMI at high current performance.

  • Improved current sense resolution to allow better torque control. From 893.0 mA/count to 701.8 mA/count on version 1.2.0.
  • Added Safe Torque Off (STO) bypass jumpers.
  • Added Sin/Cos encoder compatibility.
  • Separated the Incremental encoder from the Absolute encoder connectors. The pinout is still 100% compatible with wirings of version 1.1.0.
  • Added power terminals plastic insulator and stiffener to make connections more robust.
  • Improved EMI USB robustness. This allows for operation at high power even with USB connected.
  • Removed Safe Torque Off error at power-up that caused the reset.
  • Improvement of overcurrent performance.
  • Improvement on EMI of the power stage.
  • Manufacturing improvements.


Identifying the hardware revision

Hardware revision is screen printed on the board. It can also be read from Motion Lab - Drive parameters.

Power and current ratings

TTN-x/xx-C-C variants of Titan Go are capable of providing the nominal current from -40 ºC to 85 ºC (temperature measured in the cold plate) with a 0.1 ºC/W heatsink (Fischer LA 11 200 24) attached by means of a low thermal resistance interface material. Above 85 ºC a current derating could be needed to prevent overheating. Above 85 ºC a current derating could be needed to prevent overheating. Please see Dimensions and assembly for further details.

In case of excessive power losses, over-temperature will be detected, causing the driver to turn off. The system temperature is available in E-Core registers and is measured near the power stage. This temperature parameter can be accessed from USB 2.0, CAN or RS485 serial interface and does not indicate the air temperature, but the temperature of the PCB. Above 110 ºC the Titan Go automatically turns off the power stage and stays in fault state avoiding any damage to the drive. The Fault LED will be activated and latched until the temperature decreases below this threshold.

Drive safety is always ensured by its protections. However, by means of it, power losses and temperature will limit the allowable motor current.

Some parts of the Titan Go can exceed 125 ºC during operation, especially at high load levels.
Do not touch the Titan Go during operation and wait at least 5 minutes after turn off to allow a safe cool down.

The following figure shows the basic power flow and losses in a servo drive system.

Power losses calculation (heat dissipation)

Current flowing through Titan Servo Drive causes power losses that, ultimately, are converted in heat. This heat must be transferred to its surrounding environment efficiently so that the temperature of the drive does not reach dangerous levels. The greater the power losses, the more effective the heat dissipation must be. Power losses mainly depend mainly on 3 parameters:

  • Motor RMS current: this is the cause of what is called static or conduction power losses, which typically are the main source of power losses, having that they show a positive correlation in a squared ratio.
  • DC bus voltage: this, along with the motor RMS current and PWM switching frequency, is the cause of what are called dynamic or commutation losses, and show positive correlation in a proportional ratio.
  • PWM switching frequency: similar to DC bus voltage, the PWM switching frequency directly affects the commutation losses. Typically, 10 kHz is the default value to reduce these losses, but it can be increased up to 20 kHz.

PWM switching frequency and nominal specifications

All nominal specifications in this manual are measured under a PWM switching frequency of 10 kHz.


PWM in SMO feedback mode

It is strongly recommended to configure the alternative PWM frequency of 20 kHz when using the sensorless SMO as a feedback source, or when controlling motors of low inductance.

Other less relevant parameters affect also the power losses but are not considered in the following graphs:

  • Air temperature: higher power semiconductor temperatures reduce their efficiency. 
  • Motor speed: faster motor speeds result in higher overall power losses since the input DC bus current is greater, and this increases conduction losses on the reverse polarity protection circuitry.

Current ratings

Power losses cause the drive to increase its temperature according to:

As power losses have a positive correlation with the motor RMS current, when the ambient temperature rises, the output current must be limited to avoid an excessive drive temperature (T< 110 ºC). The threshold temperature where the current derating should start mainly depends on the DC bus voltage. 

ParameterValueUnitsNotes
Maximum absolute power stage
temperature
110ºC

Measured on the PCB (not the heatsink) and accessible via register.

Thermal resistance from
power stage to the heatsink

0.017

ºC/WDoes not consider the thermal resistance of the heatsink, but assumes
the cold plate is a thermal conductor, not the thermal dissipator.
Thermal resistance from power stage to air5ºC/W

Considering the drive is vertical and free air convection with is allowed on the cold plate surface (> 30 cm clearance around the drive).

Mounting the drive without heatsink could only be done for very low load applications or debugging purposes, otherwise, over-temperature alarm will occur after a few minutes of operation.

Temperature stabilization
time
800sWith 0.1 ºC/W heatsink attached. Considering 90 % of the maximum temperature.


This graphic shows the maximum current with respect to ambient temperature, also assuming a 0.1 ºC/W heatsink attached.

Current derating

The current derating graph is only indicative and is based on thermal tests performed in a climatic chamber where there was enough room for natural air convection. Each application may reach different ratings depending on the installation, ventilation and/or housing.

Current derating is only a recommendation and is not performed automatically by the drive.


Maximizing heat dissipation with a heatsink

A heatsink is needed to reach the nominal current at any ambient temperatures. When using high-efficiency heatsinks or in enclosed spaces, the equation can be simplified as follows.

Assembly recommendations for best heat dissipation

  • Always allow natural air convection by ensuring ≥ 10 mm air space around the drive.
  • Use a good thermal interface material to improve the heat dissipation. See Dimensions and assembly for details.
  • If housed, use a good thermal conductivity material, such as black anodized aluminum. Placing the drive in a small plastic package will definitively reduce its temperature range.
  • Temperature range can be increased by providing forced cooling with a fan. Always ensure electrical isolation between live parts and the heatsink.

Architecture

This diagram represents the main hardware elements of Titan Go, and how they relate to each other.

Power stage and supply architecture

The following drawing shows the architecture of the power stage and its main components. Also, it clarifies how the internal power supplies are wired. For simplicity, power transistors are shown as switches.


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